| 价格 | 面议 |
|---|---|
| 品牌 | Indium |
| 区域 | 全国 |
| 来源 | 苏州贝俊轮商贸有限公司 |
详情描述：
Introduction Indium9.0A is an air reflow, no-clean solder paste specifically formulated to accommodate the higher processing temperatures required by the SnAgCu, SnAg, and other alloy systems favored by the electronics industry to replace conventional Pb-bearing solders. Indium9.0A offers unprecedented stencil print transfer efficiency to work in the broadest range of processes. In addition, the high oxidation resistance of Indium9.0A virtually eliminates incomplete coalescence (graping) of small deposits. Features High transfer efficiency through small apertures (≤0.66AR) Eliminates graping phenomenon on small deposits Low voiding in BGA/CSP solder joints Packaging Indium9.0A is currently available in 500g jars or 600g cartridges. Packaging for enclosed print head systems is also readily available. Alternate packaging options may be available upon request. Compatible Products ? Rework Flux: TACFlux? 020B, TACFlux? 089HF ? Cored Wire: CW-802, CW-807 ? Wave Flux: WF-7745, WF-9945
| 联系人 | 陈先生 |
|---|
